For all AXI machines you can perform the shadow check. This test checks if the material is covered from bottom to top and inverted.

It also supports combination with AOI machines, you have settings for each package type to set the check, e.g. for a chip component it should check only with orthogonal AOI camera, for qfn components with angle camera and for bga all pins checked with AXI analysis.

For each package group you can define the visible pins, hidden pins and material for bodx and or pins: