Stencil Analysis

Stencil analysis is used to find undersized soldered pastes. This depends directly on the stencil thickness.

Stencil Analysis

Before starting the production of a pcb, this analysis` goal is to determine, whether the soldering paste (due to its small surface) can detach from the stencil

In this analysis only layers are checked, which are defined als soldering paste layers. Looking at the matrix, it is easy to see, which layers are checked here.

Configurable options in the stencil analysis are shown in the following picture.

1. Stencil thickness indicates the thickness of the stencil. Since the wall surface of the solder pastes openings determines the thickness of the stencil, it must be selected as thin as necessary and as thick as possible. The thickness of the stencil is an important factor for its longevity, but it negatively affects the adhesion of the soldering paste.

2. Mark lines with ratio describes the relation of the solder pastes to the solder pastes wall openings surface of the stencil. This relation can be freely selected, but there are default values, which are defined in the IPC-725A (3.2.1.2 area ratio/ aspect ratio). The fixed default value should be at 0.66.

3. Check only in PCB Profile allows the examination of PCBs across the PCB edge and enables to include the exterior.

The results contain information such as the layer with a too narrow solder paste. To display only the requested results, it is possilble to filter each of the attributes (blue box) shown below using a term (red circle).

In order to secure the results, you can find the option "export"/ "export to file" under the the tab "file" or in the lower right corner. It stores the results in a CSV file.