Edit base settings for each area

Context Menu

You have several options available to modify your file, including changing the thickness,
side, or description, as well as setting a color for the zone. Additionally, you can export
the file as a list or HTML and such much more opti

 

 

 

 

Set Area around Selection with cutouts

This function allows you to define a stencil area by selecting a group of objects and creating a cutout area around them. The cutout area can be used to create stencil pads for solder paste application.

 

Add zones by predefined drawings

 

Edit the Shape

 

Add a new zone by drawing a rectangle

Note: For high quality, it is recommended not to cut pin pads. You can combine areas e.g. from different parts to get ideal areas.

 

 

Zone function

 

Add new zone with cutting out a previous tone by drawing a rectangle

This means creating a new zone by drawing a rectangle on the PCB design and cutting out a portion of a previous tone that intersects with the new recatangle.

 

 

 

  Combine different zones to one zone 
Combining by bounds or intersecting available, depending on the zone size maybe the form has to be an rectangle or it is possible to set special area outlines.

 

Manage zone settings

 

 

 

-->Zone settings can be saved in ODB attributes, exported as xml and imported from xml.

 

 

If you are done generating, you should do the stencil analysis. Click Here!

 

The Stencil Generator uses all zones defined by the Stencil Area Editor. If there are no zones the outline will be used as main zone. Use default rules for your company. Setting a package group, enables the Wizard to set the rules regarding it. SOICs, Chips, BGAs and any definition needed. The Wizard is delivered with predefined settings. To adjust all data preparation to your product you can setup own data preparation Scripts to adjust to your equipment.

Set Package Group is only necessary if your data don’t contain a proper information. Customers with EPL (“Easylogix Part Library”) can resolve trusted data from EPL. The Wizard also process layouts with multiple mask layers in the stack-up. Set “Keepouts for Chips” is only available if you have MPN packaged defined. It will handle the usable area for you. You also can set plugged drills as free usable area.

Check stencil by using current rules

Rule preview

You have the possibility to set rules by package, set extra rules for components in defines zones or to set a rule for each component.
To set another rule to your component, select one in the given list. 

All Rules explained below

 

Add own rules to your stencil automation

You can add your own rules by clicking on the setting symbol.

 

 

 

Panel

Send the stencil data in your preferred format to your supplier	Result of the rule-base stencil wizard
Before and after	Stencil pad details

 

To automate your custom stencil scripts, it is necessary to use the StencilCreationScript interface.

Here is a link to see all details for your implemention manual.

You have to set public porperties to give user options to change in the property grid, there is also a method to create the preview and the pads. You should fill the corde with all calculation you need e.g.

public bool CreatePads(IPCBIWindow parent, IStep step, IODBLayer StencilLayerOutput, InterfaceCMPObject BasicObjects, List<IPolyClass> UsedPinPads, List<IPolyClass> MaskForCheck, List<IPolyClass> Drills, double ThicknessPaste)
{
if (StencilLayerOutput == null || BasicObjects == null || UsedPinPads.Count == 0)
return false;

bool IntersectWithMask = false;

CreateRectangleElement(StencilLayerOutput, UsedPinPads, MaskForCheck, Drills, BasicObjects, out IntersectWithMask);

return true;
}

In the options area (1) you can add your custom developed scripts (2).

This rule specifically addresses the process of creating stencils for different package groups, each with its unique characteristics and requirements. It is important to have the PACKAGE_GROUP property!

You can import an library to get the PACKAGE_GROUP Property or let PCB-Investigator create them for standard definitions (check the Edit menu => Set Package Group)

• CHIP - offers the option to create stencils that resemble a house or an inverted house shape
• SOIC/QFP - treats each pad as a rectangle, but cooling pins are handled as an array.
• BGA - small pins handled with rounded recthangles, bigger pins applies an undersize rule to each pin. This means that the stencil pads for the BGA package's pins are intentionally created slightly smaller than the actual pin size
• Other - use undersize for all pins

Note: this rule is the most powerfull rule and handle all types of packages with good pad creation rules, we recommend to use this ad default and handle only special packages with extra rules!

The StencilScriptUndersize class defines the necessary parameters to create a similar structure around a stencil pad for solder paste applications with smaller size. It is used for automating stencil generation and includes geometry, shape characteristics, and spacing considerations.

Properties

These parameters help define the geometric and contextual constraints for automatically generating stencil pad protection using a smaller-shaped perimeter.

Note: If the undersize values to small no pad will be created, the rule checks the mask layer for intersecting!

Donut Creation for Stencil Pads

In stencil design, a donut shape is used to define a circular opening with a central void (hole), commonly used for thermal reliefs or annular ring designs. The donut is generated around a pad center based on several configurable parameters.

Donut Properties

Usage

These properties are used by the StencilScriptDonut class to calculate and render the donut shape on stencil pads. The donut is typically composed of an outer arc (outer diameter) and an inner arc (inner diameter), combined with connecting lines to form a closed shape.

Ensure that InnerDiameter is less than OuterDiameter to create a valid donut. Adjust AngleStep based on performance vs. accuracy needs.

Array creation is used to replicate pad openings in a structured pattern. This is especially useful for components like QFP or QFNs,
where cooling pads are very big and replaced by array formation. The array is defined using specific rules and transformation parameters, it gives you an easy way to define an array of similar (rounded) rectangles.

Array (Fix) Properties

Usage

These properties are used in the StencilScriptArray class to define how shapes are duplicated and transformed. Each array pattern follows a specific logic:

- check avalable size of array

- check max pad size and gap value

- split area in pads and round the rectangles

Use array rules to easily build consistent and scalable designs for components with repeated pad layouts.
Adjust offset values to fine-tune placement, it also has an utilization property to gives the rule an optimum of area.

The StencilScriptHouse class defines the necessary parameters to create a house structure around a stencil pad for solder paste applications. It is used for automating stencil generation and includes geometry, shape characteristics, and spacing considerations.

Properties

These parameters help define the geometric and contextual constraints for automatically generating stencil pad protection using a house-shaped perimeter. The house rule is recommended for chip packages, but can be used for all pins with clear directions. 

Note: If the pin is under the body the direction cannot be calculated and no house is created.

Depending to the chip size it is recommended to change from house to inverted house rules.

Inverted House Properties

Usage

These properties are used in the StencilScriptInvertedHouse class to define how shapes (such as stencil pads or vias) are duplicated and transformed. In general this rule is used for Chip Packages.

Note: If the pin is under the body the direction cannot be calculated and no house is created.

The StencilScriptSimpleSurface class defines the necessary parameters to create a rectangle structure around a stencil pad for solder paste applications. It is used for automating stencil generation and includes helpfull options.

Properties

These parameters help define the geometric and contextual constraints for automatically generating stencil pad protection using a rectangle-based-shaped perimeter.

Note: The simple rectangle rule ignore the mask opening and overprint it!

The StencilScriptUsePinMinusMask class defines the necessary parameters to create a pin bases structure. It is used for automating stencil generation and includes geometry, shape characteristics, and spacing considerations. 

This rule gives you the option to use the pin outline as basis with following options:

Properties

These parameters help define the geometric and contextual constraints for automatically generating stencil pad protection using the pin definition as basis.

Note: If the undersize values to small no pad will be created, the rule checks the mask layer for intersecting and it is a special handling for Overwrite All Pins to replace all pins with one rule!