1. With this button, you are able to create a new test session which will be added to the list "Test Runs".
2. This list shows all existing test sessions. By using the right mouse button, you can delete, copy or rename them. By a simple click, the session is loaded and shown on the right side.
3. If your design has multiple steps (e.g. single board + panel), here you can select the step where probes should be added or managed. You can e.g. add probes to the single board, but export the panel afterwards (the probes of the single board will be reproduced).
4. These buttons allow to import/export the current test setup options from/to other layouts.
5. Settings for automatic creation of probes, vary on tester type (fixture/fixtureless). Options will be described later.
6. Once probes are created, you can define their visibility for the two sides here.
7. Save button to save the current session and Export button to export the session to one of the available tester machines.

 

Fixture Parameters:

Tester Type:

Tester Type to use for the automatic probe creation

Probe Side:

Search probes on this/these side(s)

Exclude Single-Pin Net:

Exclude No/Single-Pin Net, all no-pin and single-pin net entries will not create probe entries.

Use max. Test Resources from Net Setup:

If yes, only the given number of Probes are created. If no, all Probes are created

Search Tasks (Top):

Defines the tasks and the order for searching probes on top side

Search Tasks (Bot):

Defines the tasks and the order for searching probes on bot side

Available Needles:

All allowed needles for fixture probes. Will be used beginning with the largest one. Here also the needed distances to components are defined per needle definition

Standard min. Distance to Components:

If no special distance is defined for the given needle, this is the standard min. distance from probe center to surrounding components

Minimum Distance between Probes:

The minimum distance between Probes, measured from outline to outline (taking diameter of the Needle Definition into account)

TP Reference Filter List:

Comma separated reference filter list (e.g. \"TP, P\"). TP Components must start with one of these entries.

TP Pad Recognition:

Recognize test points by the '.test_point' attribute on copper pads.

Minimum pad size to use as probe (Top):

Minimum copper pad size to create a probe for top side.

Minimum pad size to use as probe (Bot):

Minimum copper pad size to create a probe for bot side.

Enable Solder Mask Analysis:

Enable Solder Mask Analysis, only round pads with openings in solder mask are used if this setting is active.

Minimum pad size to use as probe (Top):

Minimum pad size to create a probe for top side.

Minimum pad size to use as probe (Bot):

Minimum pad size to create a probe for bot side.

Maximum drill diameter to use as probe:

Maximum drill diameter to create a via probe.

Enable Solder Mask Analysis:

Enable Solder Mask Analysis, only round pads with openings in solder mask are used if this setting is active.

Minimum pad size to use as probe (Top):

Minimum pad size to create a probe for top side.

Minimum pad size to use as probe (Bot):

Minimum pad size to create a probe for bot side.

Minimum annular ring to use as probe (Top):

Minimum annular ring to create a probe for top side.

Minimum annular ring to use as probe (Bot):

Minimum annular ring to create a probe for bot side.

 

Fixtureless parameters:

Tester Type:

Tester Type to use for the automatic probe creation

Probe Side:

Search probes on this/these side(s)

Exclude Single-Pin Net:

Exclude No/Single-Pin Net, all no-pin and single-pin net entries will not create probe entries.

Use max. Test Resources from Net Setup:

If yes, only the given number of Probes are created. If no, all Probes are created

Exposed Copper - Exposed Copper:

The minimum distance between exposed copper areas to not be reported in the Short Analysis (0=deactivated)

Copper - Copper:

The minimum distance between any copper areas to not be reported in the Short Analysis (0=deactivated)

Drill - Drill:

The minimum distance between plated drills to not be reported in the Short Analysis (0=deactivated)

Only Nets with Components:

Only nets with components are checked

Search Tasks (Top):

Defines the tasks and the order for searching probes on top side

Search Tasks (Bot):

Defines the tasks and the order for searching probes on bot side

Minimum distance to Board Outline (Upper Side):

Minimum distance from fixtureless access point center to upper board outline

Minimum distance to Board Outline (Lower Side):

Minimum distance from fixtureless access point center to lower board outline

TP Reference Filter List:

Comma separated reference filter list (e.g. \"TP, P\"). TP Components must start with one of these entries.

TP Pad Recognition:

Recognize test points by the '.test_point' attribute on copper pads.

Minimum pad size to use as probe (Top):

Minimum copper pad size to create a probe for top side.

Minimum pad size to use as probe (Bot):

Minimum copper pad size to create a probe for bot side.

Enable Solder Mask Analysis:

Enable Solder Mask Analysis, only round pads with openings in solder mask are used if this setting is active.

Minimum pad size to use as probe (Top):

Minimum pad size to create a probe for top side.

Minimum pad size to use as probe (Bot):

Minimum pad size to create a probe for bot side.

Maximum drill diameter to use as probe:

Maximum drill diameter to create a via probe.

Enable Solder Mask Analysis:

Enable Solder Mask Analysis, only round pads with openings in solder mask are used if this setting is active.

Minimum pad size to use as probe (Top):

Minimum pad size to create a probe for top side.

Minimum pad size to use as probe (Bot):

Minimum pad size to create a probe for bot side.

Minimum annular ring to use as probe (Top):

Minimum annular ring to create a probe for top side.

Minimum annular ring to use as probe (Bot):

Minimum annular ring to create a probe for bot side.

Offset for the Probe Placement (%):

This parameter is used, if Probes are set to Pins where no TESTPROBE_KEEPOUT but a MPN Package Outline exists. The probe is placed on x % of the distance from the outer edge of the pin to the edge of the MPN Package Outline (also see next parameters). If a keepout is defined, the probe will be placed to the middle of the remaining pin contact area. If no MPN Package Outline is defined, 'Offset Limit for the Probe Placement' is used for the offset.

Offset Limit for the Probe Placement:

This parameter is used, if Probes are set to Pins where no TESTPROBE_KEEPOUT exists. The offset distance calculated with 'Offset for the Probe Placement (%)' is limited to this value, so the offset will not be larger as this value. If no MPN Package Outline exists, this value is used for the offset.

Minimum needed Offset for the Probe Placement:

This parameter is used, if Probes are set to Pins where no TESTPROBE_KEEPOUT but a MPN Package Outline exists. If the offset distance calculated with 'Offset for the Probe Placement (%)' is smaller than this value, no Probe will be placed.

Minimum Pin Size:

Minimum Pin size to be used for the Probe Placement (width and height must be larger/equal

1. This button fills the “Device” column in the list from the value of the DESCRIPTION Property of the components (if exististing).
2. The list shows all components of this data step and allows you to add additional information to each component.
3. In the context menu some important functions are easily accessible or the “Edit” (4) dialog can be opened.
4. In the “Edit” dialog, you can correct the “Mounting Type” if it was not available in the imported layout data, you can define whether a component is really placed or if it is not in the BOM (“Ignore in Output = true”), and you can force or prohibit the probe generation for single pins. It’s also possible to define if 4-wire measurement is needed and the test model(s) for each single component, although it is recommended to do this in the “Test Model Setup” Tab (C) for all components of the same part number at once.
5. This list gives you an overview of how the pins of the selected components are wired. This information may help to define test models, especially when it comes to define the pin types of Diodes (Anode/Cathode) or Transistors and others.
6. With this button you can add own columns to the list by stating a property name, e.g. “MPN” for the material part number or “Manufacturer”. Of course, those properties must exist in the layout data.

1. The list shows all different part numbers of this data step and allows you to define the test model(s) for each part.
2. In the context menu some important functions are easily accessible (e.g. copy/paste of test models) or the “Edit” (3) dialog can be opened.
3. In the “Edit” dialog, you can define test models for this part. It is possible to add multiple test models (e.g. 4 Capacitor test models for a Capacitor Array).
4. Each available test model has different parameters that describe the test. Depending on the export type (e.g. Seica/Takaya/i3070) all or parts of this information is needed/used. One of the most important information is the pin mapping, so e.g. which pin number is the Anode and which is the Cathode of a Diode.

Following test models are available: See appendix.

1. The list shows all different nets of this data step and allows you to define the type and the number of probes per net.
2. In the context menu some important functions are easily accessible (e.g. Select Net) or the “Edit Net(s)” (3) dialog can be opened.
3. In the “Edit” dialog, you can define the type of a net (power/ground/signal) and the needed number of test resources (probes). In the “Test Setup” (A) this number is used for the probe creation (“Use max. Test Resources from Net Setup”).

1. This button creates the probes according to the rules defined in the Test Setup (A). If probes already exist, you’ll be asked if you want to keep and only supplement them, or if you want to delete all probes that are not fixed bevor creating new ones.

   Additional Rules:

   • The first probe per net will be given “Probe Access = Forced”
   • If more than one probe is needed for a net (see “Net Setup (D)”), those probes will have “Probe Access” set to “Alternative”
   • If “Use max. Test Resources” is set to false in Test Setup (A), probes that go beyond the needed number will have “Probe Access” set to “No”
   • If a component in the net needs 4-Wire-Measurement (“Component Setup (B)”) and only one probe is possible in this net, there will be a second probe created at the same location as the first one
   • If a fixture probe location is too close to a component, the next smaller needle size is used. If the smallest needle is still too close to a neighbor component, no probe will be created.
   • The probe type depends e.g. on the component type (SMD/THT of the “Component Setup (B)”) or the Component Reference name (“TP Reference Filter List” in “Test Setup (A)”)
   • Pad and hole sizes are taken from the layout
2. The list shows all probes with their nets, locations and properties.
3. In the context menu some important functions are easily accessible (e.g. Delete) or the “Edit” (4) dialog can be opened.
4. In the “Edit” dialog, you can change following properties of the selected probe(s). 
   
   • Location: Board location of the Probe
   • Probe Designator: Probe Designator (e.g. TP100) to which this probe belongs
   • Access Type: Access Type (Fixture/Fixtureless)
   • Accessible Side(s): Accessible Side(s) for this probe (Top/Bot/Both)
   • Probe Side: Probe Side (Top/Bot)
   • Probe Type: Probe Type (TestPoint, THT, VIA, SMD, …)
   • Probe Access: Probe Access Type (Forces/Alternative/No)
   • Fixed: Probe location is fixed and Probe will be kept if probes are recreated
   • Needle Definition Name: Name of definition of the needle. Must match a value in the 'Available Needles' section of the Test Setup (A)
   • Probe Pad Size: Pad Size of this Probe
   • Probe Hole Size: Hole Size of this Probe
5. The "Check Probe Distances" button checks the distance between the probes in the list according to the “Minimum Distance between Probes” parameter of the “Test Setup (A)”. Rule violations will be highlighted in red color and additional information in the “Violation” column of the list. The "Optimize Needle Sizes" button trys to find the best possible needle sizes, therefore the "Minimum Distance between Probes" parameter of the “Test Setup (A)” is used. The algorithm trys to keep the largest possible needles, e.g. by setting two close needles both to 75mil instead of one to 100mil and the other to 50mil.
6. Visualization options to highlight pins with probe access or select/jump to selected probes
7. Clear the list and delete all probes

1. Update Button to force update of list entries and statistics
2. Statistics for the net access via probes
3. List of the accessible nets with probes
4. List of nets without access including information about unused test points
5. List of unused test points with net information
6. In the context menu some important functions are easily accessible (e.g. Select net) or the “Show Details” (7) dialog can be opened.
7. This dialog shows the probes and pins for the selected net.
8. It’s possible to add manual probes to certain pins by setting this pin to “ForceProbe” in the “Probe Setting” of the “Component Setup (B)”.

1. Button to run the short analysis according to the rules defined in the “Test Setup (A)”.
2. List of all found shorts. By selecting a line, the short is shown graphically in PCB-Investigator.
3. The context menu offers the possibility to delete single short measurements before starting the export.

 

Short measurements will be added in different ways to the exported files:

I3070:
Shorts are not used, as this is a “Fixture” test system

Seica:                   
Short measurements are exported to the “.shi” file, together with shorts measurements from Pin2Pin test models. Redundancies will be removed first.

Takaya:
Short measurements are exported as Resistor Tests (@K OP). Redundancies with Pin2Pin test models are removed first.

The Seica export creates a package of files (.alf/.inf/.nod/.par/.sha/.shi) that contain all available component and net information to easily create the test program in the VIVA Software of Seica.

Following export settings are possible:

• Additional Channel Offset: If a channel is set by AutoSetChannels or TryToParseChannelNumberFromComment, this channel will be incremented by this offset (e.g. AdditionalChannelOffset=1 => Channel 100 will be exported as 101)
• Auto Set Channels: Set a unique channel number per Forced/Alternative Probe (if TryToParseChannelNumberFromComment=false)
• Try to Parse Channel Number from Comment: If the channel number is stated in the comment of the probes, this number will be used in the Seica export. (AutoSetChannels will not be used!)
• Side Switch: If true, the PCB will be checked from bottom up
• Rotation: If >0, the PCB will be rotated clockwise by this angle (e.g. 90°) after applying the SideSwitch command (if SideSwitch=true)
• Resistor Macro Name: Macro name for Resistor (Value from Property: %PROP_NAME%)
• Capacitor Macro Name: Macro name for Capacitor (Value from Property: %PROP_NAME%)
• Inductor Macro Name: Macro name for Inductor (Value from Property: %PROP_NAME%)
• Diode Macro Name: Macro name for Diode (Value from Property: %PROP_NAME%)
• LED Macro Name: Macro name for LED (Value from Property: %PROP_NAME%)
• Zener Macro Name: Macro name for Zener (Value from Property: %PROP_NAME%)
• Transistor (NPN) Macro Name: Macro name for NPN Transistors (Value from Property: %PROP_NAME%)
• Transistor (PNP) Macro Name: Macro name for PNP Transistors (Value from Property: %PROP_NAME%)
• Mosfets (N) Macro Name: Macro name for N-Channel Mosfets (Value from Property: %PROP_NAME%)
• Mosfets (P) Macro Name: Macro name for P-Channel Mosfets (Value from Property: %PROP_NAME%)
• Jumper (Open) Macro Name: Macro name for Open Jumper (Value from Property: %PROP_NAME%)
• Jumper (Closed) Macro Name: Macro name for Closed Jumper (Value from Property: %PROP_NAME%)
• Switch (Open) Macro Name: Macro name for Open Switch (Value from Property: %PROP_NAME%)
• Switch (Closed) Macro Name: Macro name for Closed Switch (Value from Property: %PROP_NAME%)
• Potentiometer Macro Name: Macro name for Potentiometer (Value from Property: %PROP_NAME%)
• Fuse Macro Name: Macro name for Fuse (Value from Property: %PROP_NAME%)
• Opto Photo Coupler Macro Name: Macro name for Opto Photo Coupler (Value from Property: %PROP_NAME%)
• ICOpen Macro Name: Macro name for ICOpen (Value from Property: %PROP_NAME%)
• Pin2GND Macro Name: Macro name for Pin2GND (Value from Property: %PROP_NAME%)
• Pin2GND+ICOpen Macro Name: Macro name for Pin2GND AND ICOpen (Value from Property: %PROP_NAME%)
• Standard Macro Name: Macro name for Components without Test Models (Value from Property: %PROP_NAME%)
• Standard Device Name: Device name for Components without Test Models (Value from Property: %PROP_NAME%)
• Multi Model Macro Name: Macro name for Components with more than one Test Model (Value from Property: %PROP_NAME%)
• Multi Model Device Name: Device name for Components with more than one Test Model (Value from Property: %PROP_NAME%)
• Not mounted Macro Name: Macro name for Components that are 'ignored in output' (Value from Property: %PROP_NAME%)
• Not mounted Device Name: Device name for Components that are 'ignored in output' (Value from Property: %PROP_NAME%)
• Special Macro/Device Rules: Rules to define the Macro and Device according to a property value. Overrides all other Macro/Device settings
• Pin2Pin Max Distance (MM): Maximum distance for pins of different nets to be tested for short circuit (µm)
• Standard Diode Test Value (mV): Test value for standard diodes in mV
• Standard Diode Tolerance: Tolerance for standard diodes (%)
• Schottky Diode Test Value (mV): Test value for schottky diodes in mV
• Schottky Diode Tolerance: Tolerance for schottky diodes (%)
• LED Diode Test Value (mV): Test value for LED diodes in mV
• LED Diode Tolerance: Tolerance for LED diodes (%)
• Inductor Tolerance Addition (%): Inductor Tolerance Addition in %
• Resistor Tolerance Addition (%): Resistor Tolerance Addition in %
• Capacitor Tolerance Addition (%): Capacitor Tolerance Addition in %

The Takaya export creates a “.ca9” file containing a whole test program. This includes a wire analysis where parallel and serial Resistors/Capacitors/Inductors are merged if there are not enough probes to test them separately. For small value components, that get lost in the tolerance of the overall circuit, additional Vision Tests are created.
The export can be done for one-sided Takaya machines as well as for two-sided ones (4 fingers on one side, 2 on the other).

Following export settings are possible:

• Machine Type: Machine Type (Double Sided / Single Sided)
• Minimum Component Height (MM): Min. Component Height to export as High-Fly Zone
• Maximum Component Height (MM): Max. Component Height to export as High-Fly Zone
• Additional Safety Distance (MM): Additional Safety Distance added on the Component Height
• Side Switch: If true, the PCB will be checked from bottom up
• Rotation: If >0, the PCB will be rotated clockwise by this angle (e.g. 90°) after applying the SideSwitch command (if SideSwitch=true)
• Short Measuring Time: Short Measuring Time (@MT) (<0 => Not used)
• Resistor Measuring Time: Resistor Measuring Time (@MT) (<0 => Not used)
• Diode Measuring Time: Diode Measuring Time (@MT) (<0 => Not used)
• Zener Measuring Time: Zener Measuring Time (@MT) (<0 => Not used)
• Photo Coupler Measuring Time: Photo Coupler Measuring Time (@MT) (<0 => Not used)
• Diode Measuring Range: Diode Measuring Range (@MI) (<0 => Not used)
• Upper Limit for 0-Ohm Resistor (Ohm): Upper Limit for 0-Ohm Resistor in Ohms (@MR)
• Lower Limit for ignored Resistor (MOhm): Lower Limit for ignored Resistor in MOhm (@MR)
• Upper Limit for ignored Capacitor (pF): Upper Limit for ignored Capacitor in pF (@MR)
• Lower Limit for ignored Diodes (V): Lower Limit for ignored Diodes in V (@MR)
• Diode Tolerance Plus: Diode Tolerance Plus (@T)
• Diode Tolerance Minus: Diode Tolerance Minus (@T)
• ICOpen Forced: Export ICOpen Test, also if Component is too small
• ICOpen Tolerance Plus: ICOpen Tolerance Plus (@T)
• ICOpen Tolerance Minus: ICOpen Tolerance Minus (@T)
• ICOpen Sensor Diameter (MM): ICOpen Sensor Diameter (in Millimeter)
• Pin2Pin Max Distance SMT (MM): Pin2Pin Test: Maximum distance for SMT pins of different nets to be tested for short circuit (µm)
• Pin2Pin Max Distance THT (MM): Pin2Pin Test: Maximum distance for THT pins of different nets to be tested for short circuit (µm)
• Conveyor Margin (@Y): Conveyor Margin (µm) (<0 => Not used)
• Probe Speed for TEST_POINT: Probe Speed per Land Figure (@PS)
• Probe Speed for THD*: Probe Speed per Land Figure (@PS)
• Probe Speed for SMD_SMALL: Probe Speed per Land Figure (@PS)
• Probe Speed for SMD_MEDIUM: Probe Speed per Land Figure (@PS)
• Probe Speed for SMD_LARGE: Probe Speed per Land Figure (@PS)
• Probe Speed for CONNECTOR: Probe Speed per Land Figure (@PS)
• Probe Speed for DIP: Probe Speed per Land Figure (@PS)
• Probe Speed for PAD: Probe Speed per Land Figure (@PS)
• Create LED Color Test: Create Dummy LED Color Test Entry (Location=CT)
• Create Vision Test: Create Vision Test for Components without TestModels (@V5)
• Export @VO Option: Export @VO option (Offset for THTs)
• Export @W Option: Export @W option (board width/height) in the CA9 Header
• Ignore NC Pin at ICOpen: Ignore NotConnected Pins at ICOpen TestModels
• Ignore NC Pin at Pin2GND: Ignore NotConnected Pins at Pin2GND TestModels
• Unique Test Step Names: Each Test Step should have a unique name instead of the PartName (except Pin2Pin, Pin2GND and ICOpen)
• Use Testprobe-Keepout as Highfly: Use the TESTPROBE_KEEPOUT instead of the REAL_BODY_OUTLINE as Highfly-Area
• Inductor Tolerance Addition (%): Inductor Tolerance Addition in %
• Resistor Tolerance Addition (%): Resistor Tolerance Addition in %
• Capacitor Tolerance Addition (%): Capacitor Tolerance Addition in %

The i3070 export creates a “board” and “board_xy” file that contain all available component and net information to easily create the test program with the native machine software.

Following export settings are possible:

• Side Switch: If true, the PCB will be checked from bottom up
• Rotation: If >0, the PCB will be rotated clockwise by this angle (e.g. 90°) after applying the SideSwitch command (if SideSwitch=true)
• Fixture Type: Fixture Type
• Fixture Size: FULL, BANK1, BANK2
• Top Probes Allowed: ON/OFF
• Heavy Probe Force: Heavy Probe Force
• Light Probe Force: Light Probe Force
• Mechanical Density Threshold: Mechanical Density Threshold
• Vacuum Density Threshold: Vacuum Density Threshold
• Autofile: Autofile
• Test Strategy: COMBINATIONAL, EDGE CONNECTOR ONLY
• Wire Wrapping: MANUAL, AUTO, WIRELESS, SEMI AUTO
• Metric Units: ON/OFF
• Common Lead Resistance (Ohm): 0.1m ohm to 100 ohms.
• Common Lead Inductance (µH): 0.1n Henry to 1m Henry
• Capacitance Compensation: Capacitance Compensation
• IPG Digital Resistance Threshold (Ohm): IPG Digital Resistance Threshold, Value in ohms
• Preconditioning Levels: Preconditioning Levels
• Additional Board Voltage: 0-100
• Use Agilent DriveThru Test: Use Agilent DriveThru Test
• DriveThru Impedance Threshold (Ohm): DriveThru Impedance Threshold
• Boundary Scan Overdrive: ON/OFF
• Boundary Scan Disable: ON/OFF
• Boundary Scan Chain Override: ON/OFF
• Ground Bounce Suppression: ON/OFF
• Powered Shorts Shorting Radius (mils): 1-250
• Tolerance Multiplier: 0.1 - 10
• Remote Sensing: ON/OFF
• Fuse Threshold: Fuse Threshold
• Diode Current (A): Diode Current
• Zener Current (A): Zener Current
• Adjust: NONE, FAST, ACCURATE
• Upstream Disable: ON/OFF
• Upstream Condition: ON/OFF
• Test Strategy Cover Extend: BSCAN, HYBRID, HYBRIDGUARD, BSCANGUARD
• Family Options: Family Options contain a list of different family options with settings e.g. for TTL/ECL/LVC...
• Library Options: Library Options contain a list of library paths e.g. './custom_lib'
• Inductor Series-R (Ohm): Inductor Series-R Standard Value
• Transistor High Beta (V): Transistor High Beta Value (If value=0 in test model)
• Transistor Low Beta (V): Transistor Low Beta Value (If value=0 in test model)
• FET High Resistance Limit (Ohm): FET High Resistance Limit (0.1 Ohm - 1 MOhm)
• FET Low Resistance Limit (Ohm): FET Low Resistance Limit (0.1 Ohm - 1 MOhm)
• FET Enhancement Gate Voltage (V): FET Enhancement Gate Voltage (0-9V)
• Fuse Max Current (A): Fuse Max Current
• Failure Message: Failure Message (Value from Property: %PROP_NAME%)
• Failure Message (NOPOP): Failure Message for NOPOP components (Value from Property: %PROP_NAME%)
• Part number field: Part number field value (Value from Property: %PROP_NAME%)
• Part number field (NOPOP): Part number field value for NOPOP components (optional if not PIN LIBRARY) (Value from Property: %PROP_NAME%)
• Special Partname Rules: Rules to rename parts according their original name
• Export Component Outline: Export Component Outline in XY File (DEVICE Section)
• Merge all NC Nets: Merge all NC nets into a single NC net
• Export Transistor as PinLibrary: Export Transistor Model as PinLibrary
• Export FET as PinLibrary: Export FET Model as PinLibrary
• Export Diode as PinLibrary: Export Diode Model as PinLibrary
• Export LED as PinLibrary: Export LED Model as PinLibrary
• Export Zener as PinLibrary: Export Zener Model as PinLibrary
• Export Fuse as Jumper: Export Fuse Model as Jumper Close
• Export Inductor as Jumper: Export Inductor Model as Jumper Close
• Export Switch as Jumper: Export Switch Model as Jumper Close
• Probe Reference Prefix: Reference prefix for dummy components at probe locations
• Suppress Needle Sizes: Suppress Needle Sizes in XY-File (39MIL/50MIL)
• Export PartNumber and FailureString: Export Partnumber and Failure String for all components. If false, Partnumber and Failure String is exported only for PinLibrary components.
• Inductor Tolerance Addition (%): Inductor Tolerance Addition in %
• Resistor Tolerance Addition (%): Resistor Tolerance Addition in %
• Capacitor Tolerance Addition (%): Capacitor Tolerance Addition in %

The Elowerk export creates a “xCAM” file that contain all available component and net information to easily create the test program with the native machine software. Optionally also Excellon2 files to create the adapter can be exported.

Following export settings are possible:

• Part number field: Part number field value (Value from Property: %PROP_NAME%)
• Part number field (NOPOP): Part number field value for NOPOP components (Value from Property: %PROP_NAME%)
• Inductor Tolerance Addition (%): Inductor Tolerance Addition in %
• Resistor Tolerance Addition (%): Resistor Tolerance Addition in %
• Capacitor Tolerance Addition (%): Capacitor Tolerance Addition in %
• Export FUSE as RESISTOR: Export FUSE Models as RESISTOR with fix Value (100mOhm/10%)
• Export JUMPER as RESISTOR: Export JUMPER Models as RESISTOR with fix Value (100mOhm/10%), or as SWITCH
• Export SWITCH with Open State: Export SWITCH Models always with Open State
• NAIL Start Index: Start Index for FIXTURE Nails
• Special Partname Rules: Rules to rename parts according their original name
• Export TOP Probes (.ex2): Export TOP Probes as Excellon2
• Export BOT Probes (.ex2): Export BOT Probes as Excellon2
• Export Tooling Drills (.ex2): Export Tooling Drills as Excellon2 with 1.0mm Diameter
• Use Metric Unit (Excellon2): Use metric (true) or imperial (false) unit for excellons
• Export Probes (.xlsx): Export Probes as XLSX
• Set ProbeID in Comment: Changes the current session and sets the Probe ID (Channel) to the Comment column of each Probe

The Spea export creates a “CAD” file that contain all available component and net information to easily create the test program with the native machine software.

Following export settings are possible:

• Side Switch: If true, the PCB will be checked from bottom up
• Rotation: If >0, the PCB will be rotated clockwise by this angle (e.g. 90°) after applying the SideSwitch command (if SideSwitch=true)
• Part number field: Part number field value (Value from Property: %PROP_NAME%)
• Merge all NC Nets: Merge all NC nets into a single NC net
• Inductor Tolerance Addition (%): Inductor Tolerance Addition in %
• ResistorTolerance Addition (%): ResistorTolerance Addition in %
• CapacitorTolerance Addition (%): CapacitorTolerance Addition in %
• Part Device Name: Device name for all parts (Value from Property: %PROP_NAME%)
• Use Value as Device Name (RCL): Use the value as device name for all RCL parts
• Probe Reference Prefix: Reference prefix for dummy components at probe locations
• Export PACKAGE_PINS: Export 'PACKAGE_PINS' Block
• Special Partname Rules: Rules to rename parts according their original name

 

 

 

Model	Parameter	Used for Seica	Used for Takaya	Used for i3070	Used for Elowerk	Used for Spea
Resistor	Type	√	√	√	√ (or OTHER if #Pins <> 2)	√
	Value	√	√	√	√	√
	Tolerance	√	√	√	√	√
	Pins	×	√	×	√	×
Capacitor	Type	√	√	√	√ (or OTHER if #Pins <> 2)	√
	Value	√	√	√	√	√
	Tolerance	√	√	√	√	√
	Pins	×	√	×	√	×
Inductor	Type	√	√	√	√ (or OTHER if #Pins <> 2)	√
	Value	√	√	√	√	√
	Tolerance	√	√	√	√	√
	Pins	×	√	×	√	×
Potentiometer	Type	√	√ (2xResistor)	√	√ (2xResistor)	√
	Value	×	√	√	√	×
	Tolerance	×	√	√	√	×
	Pins	×	√	√	√	√
Diode	Type	√	√	√	√	√
	Diode Type	√	×	×	×	×
	Forward Bias	×	×	√	√	×
	Test Current	×	×	×	√	×
	Pins	×	√	√	√	√
LED	Type	√	√ (as Diode)	√ (as Diode)	√	√
	Color	×	√ (2nd Diode Test)	×	×	×
	Forward Bias	×	×	√	√	×
	Test Current	×	×	×	√	×
	Pins	×	√	√	√	√
Zener	Type	√	√ (Zener+Diode)	√	√	√
	Value	√	√	√	√	×
	Tolerance	√	√	√	√	×
	Test Current	×	×	×	√	×
	Pins	×	√	√	√	√
Transistor	Type	√	√ (Transistor + 2xDiode)	√	√	√
	Transistor Type	√	√	√	√	√
	Pins	×	√	√	√	√
FET	Type	√	√ (FET + Diode)	√	√	√
	FET Mode/Type	√ (only Type)	√	√	√	√ (only Type)
	Pins	×	√	√	√	√
Fuse	Type	√	√ (4-Wire if possible)	√	√ (or OTHER if #Pins <> 2)	√
	Pins	×	√	×	√	×
Jumper	Type	√	√ (Resistor)	√	√ (Switch or Resistor)	√
	State	√	√	√	√ (Switch)	×
	Pins	×	√	×	√	×
Switch	Type	√	√ (Resistor)	√	√	√
	State	√	√	√	√	×
	Pins	×	√	√	√	×
PhotoCoupler	Type	√	√ (PhotoCoupler + Diode + Resistor)	√ (PinLibrary)	√	√
	Pins	×	√	×	√	×
Seica: Special Model	DIGITAL	√	×	×	×	×
	OPENTIC	√	×	×	×	×
	OPENFIX	√	×	×	×	×
	AUTIC	√	×	×	×	×
	VOLTAGEREGULATOR	√	×	×	×	×
	OPAMP	√	×	×	×	×
	COMPARATOR	√	×	×	×	×
	TRIAC	√	×	×	×	×
	SHORTTEST	√ (in the .shi file)	×	×	×	×
Takaya: Special Model	ICOpen	×	√	×	×	×
	Pin2Ground	×	√ (Diode Tests)	×	×	×
	Pin2Pin	×	√ (Resistor Tests)	×	×	×
i3070: Special Model	PinLibrary	×	×	√	×	×
	Connector	×	×	√	×	×
Elowerk: Special Model	All Types	×	×	×	√	×
Spea: Special Model	All Types	×	×	×	×	√

 

 

Exceptional cases:

1. If NO model exists

• Seica: Macro is set to "$DIGITAL", Device/Macro can be customized.
• Takaya: No electrical test, optionally a Vision Test is created.
• i3070: Exported as "Undefined", "Connector" or "PinLibrary" according to setting.
• Elowerk: Exported as "OTHER".
• Spea: Exported as "Analog Device" or "Test Point" (if component reference is a TP according to setting).

2. If >1 model exists

• Seica: Macro is set to "$DIGITAL", Device/Macro can be customized.
• Takaya: Each model is generated independently.
• i3070: Exported as "PinLibrary".
• Elowerk: Exported as "Cluster" with all single models included.
• Spea: Exported as Array (if there are only Resistor OR Capacitor OR Inductor OR Diode models) or "Analog Device".

3. "Ignore In Output" is true

• Seica: Macro is set to "$NOTMOUNTED", Device/Macro can be customized.
• Takaya: 

  • General:
    - Comment is set to "NOPOP".
    - Values are set to "*".

  • Special:
    - Zener: @K is set to F, @MR can be defined, no Zener Test.
    - LED: @K is set to F, @MR can be defined, no color test.
    - Transistor: @K is set to JP, no Diode Tests.
    - FET: @K is set to JP.
    - Switch, Jumper, Fuse: @K is set to OP.
    - Resistor, Diode, Pin2Ground, Potentionmeter: @K is set to F, @MR can be defined.
    - Capacitor: @K is set to E, @MR can be defined.
    - Inductor: Esported as Resistor with @K is set to OP, @MR can be defined.
    - PhotoCoupler: @K is set to JP/F(Diode)/OP(Resistor).
    - ICOpen: @K is set to JP.

• i3070:

  • General:
    - PartNumber is set to "NOPOP".

  • Special:
    - Resistor is exported as Open Jumper.
    - Capacitor is exported with 0.1pF.
    - Inductor is exported as Open Jumper.
    - Transistor is exported with 0.002/0.001V.
    - FET is exported with 99999 Ohm.
    - Diode/LED is exported with 0.002/0.001V.
    - Zener is exported with 0.001V.
    - Fuse is exported as Open Jumper.
    - Jumper is exported as Open Jumper.
    - Potentiometer is exported with 100MOhm.
    - Switch is exported "Off".

• Elowerk:

  • General:
    - PartNumber is created with export option "Part number field (NOPOP)".
    - All test models are ignored and the component is exported as "OTHER".

• Spea:

  • General:
    - In the "Part List" section, the "Mounting Side" is set to "P" (not mounted top) or "M" (not mounted bottom).

 

 

 

Watch our PCB-Investigator - DFT Preperation Video here:

Tutorial: DFT Preperation & Machine Export: