For all AXI machines you can perform the shadow check. This test checks if the material is covered from bottom to top and inverted.

It also supports combination with AOI machines, you have settings for each package type to set the check, e.g. for a chip component it should check only with orthogonal AOI camera, for qfn components with angle camera and for bga all pins checked with AXI analysis.

For each package group you can define the visible pins, hidden pins and material for body and or pins:

Machine Definition

Each machine has many options to define the cameras, the check methods (AXI, AOI Angle, AOI Orthogonal) with camera angle and the list for all package groups.

If you do not use package groups it use for all the Default rule, this means the visible pins checked by AOI Angle cameras and the hidden pins checked by AXI.

You can handle a list of different machines and use the quick selection in the main dialog to run your analysis directly.

Filter

For all AOI/AXI Analysis checks you can filter for different options like technology (SMD, THT, Pressfit, Other) and properties e.gl Comp Ignore and/or No Pop attribute.

There is also a variant handling option to filter the variant by name.