This rule specifically addresses the process of creating stencils for different package groups, each with its unique characteristics and requirements. It is important to have the PACKAGE_GROUP property!
You can import an library to get the PACKAGE_GROUP Property or let PCB-Investigator create them for standard definitions (check the Edit menu => Set Package Group)
When it comes to the package group, PCBI distinguishes between different types, such as CHIP, SOIC/QFP, and BGA.
Each package group has specific guidelines for stencil creation, and the software handles them differently to ensure optimal results.
- CHIP - offers the option to create stencils that resemble a house or an inverted house shape
- SOIC/QFP - treats each pad as a rectangle, but cooling pins are handled as an array.
- BGA - small pins handled with rounded recthangles, bigger pins applies an undersize rule to each pin. This means that the stencil pads for the BGA package's pins are intentionally created slightly smaller than the actual pin size
- Other - use undersize for all pins
Note: this rule is the most powerfull rule and handle all types of packages with good pad creation rules, we recommend to use this ad default and handle only special packages with extra rules!
