The StencilScriptHouse class defines the necessary parameters to create a house structure around a stencil pad for solder paste applications. It is used for automating stencil generation and includes geometry, shape characteristics, and spacing considerations.
| Property | Type | Description |
|---|---|---|
Corner Radius (MM) |
double | Corner radius for rounded elements in MM. |
Offset to Center (MM) |
double | Move houses to the center of the component. |
Invert Direction |
bool | For smaller elments sometimes the house should be show away from the component. |
Undersize Value (MM) |
double | All Elements will use this value in mm to generate undersize. |
House distance cut size in Percent |
double | Value in percent depending to the height of the pad. |
Utilization House Area (%) |
double | Utilization of avalable area in percent. This option will modify the cut size value to come near to the percent value. Use 0 to ignore this value. |
These parameters help define the geometric and contextual constraints for automatically generating stencil pad protection using a house-shaped perimeter. The house rule is recommended for chip packages, but can be used for all pins with clear directions.
Note: If the pin is under the body the direction cannot be calculated and no house is created.