The StencilScriptUndersize
class defines the necessary parameters to create a similar structure around a stencil pad for solder paste applications with smaller size. It is used for automating stencil generation and includes geometry, shape characteristics, and spacing considerations.
Property | Type | Description |
---|---|---|
Undersize Value in Percent |
double | All Elements will use this percent value on the smaller side to generate undersize. |
Undersize Value in MM |
double | All Elements will use this value in mm to generate undersize. |
Corner Radius (MM) |
double | Corner radius for rounded elements in MM. The value is independent of the undersize and can change the earthings with different values. |
Max Size of one Element (MM) |
double | Each element has maximum width and height, if the size is bigger it is automatically splitted in more elements. Value is in MM. |
Steg for Big Elements (MM) |
double | If the element is bigger MaxElementSize it use this value to split the size in more elements. Value is in MM. |
These parameters help define the geometric and contextual constraints for automatically generating stencil pad protection using a smaller-shaped perimeter.
Note: If the undersize values to small no pad will be created, the rule checks the mask layer for intersecting!