PCBI Manual | Stencil Generator

The Stencil Generator uses all zones defined by the Stencil Area Editor. If there are no zones the outline will be used as main zone. Use default rules for your company. Setting a package group, enables the Wizard to set the rules regarding it. SOICs, Chips, BGAs and any definition needed. The Wizard is delivered with predefined settings. To adjust all data preparation to your product you can setup own data preparation Scripts to adjust to your equipment.

Set Package Group is only necessary if your data don’t contain a proper information. Customers with EPL (“Easylogix Part Library”) can resolve trusted data from EPL. The Wizard also process layouts with multiple mask layers in the stack-up. Set “Keepouts for Chips” is only available if you have MPN packaged defined. It will handle the usable area for you. You also can set plugged drills as free usable area.

Check stencil by using current rules

Rule preview

You have the possibility to set rules by package, set extra rules for components in defines zones or to set a rule for each component.
To set another rule to your component, select one in the given list.

In the following the rules are explained:

Undersize original pads

Create undersize for each pin pad with option to switch between fix value in mm and percent value.
The base is the copper pad under the pin cutted with the mask opening.

Create donut pads

You can create Donut with X parts.

Count Bridges is here the count of gabs in the donut
Offset X/Y to move the symbol away from the pin position
Undersize for the pin pad size (distance from the pad edge to the donut edge)
The size of the inner area are in percent

Create house pads

You can create pads in form of small houses.

Corner Radius - enables users to round all corners of the house-shaped pads.

House Distance Cut Size feature - is specifically tailored for adjusting the roof splashes of the house. By modifying this value, users can control the extent to which the roof of the house extends beyond the base.

Invert Direction feature - HouseBuilder offers the ability to change the orientation of the roof. Users can switch between the roof facing the inside or outside of the pad, providing options to align with specific design requirements or personal preferences.

Handle pad creation by package group

This rule specifically addresses the process of creating stencils for different package groups, each with its unique characteristics and requirements.

When it comes to the package group, PCBI distinguishes between different types, such as CHIP, SOIC/QFP, and BGA.
Each package group has specific guidelines for stencil creation, and the software handles them differently to ensure optimal results.

CHIP - offers the option to create stencils that resemble a house or an inverted house shape
SOIC/QFP - treats each pad as a rectangle, but cooling pins are handled as an array.
BGA - applies an undersize rule to each pin. This means that the stencil pads for the BGA package's pins are intentionally created slightly smaller than the actual pin size

Array Pads

Create array pads with customizable parameters like fixed size, corner radius, distance between fields and more. These pads are cut by mask opening, and you can choose to ignore mask intersecting. Additionally, you can set a minimum array field size and adjust the offset and undersize to move the array and make the complete area smaller.

Array Pads fixed count

Create array pads with fixed size options, corner rounding and distance between pads. Offset and undersize ooptions can be used to adjust the array size.

Use pin intersecting with solder mask

Use component pins and mask to create stencil pads. This method does not use copper, but rather uses the pin definition and intersects it with the mask opening.