With the help of the "Rule File Manager" different rule sets can be created and managed.
New: Create a new rule set with a user defined name.Save: Save changes in the currently selected rule set.Delete: Delete the currently selected rule set.Import: Import a new rule set out of a xml file.Export: Export the current rule set to a xml file.Tolerance: Tolerance for all check values. All check values will be reduced by e.g. 1% to not show false errors (e.g. when checking for 150µm spacing, a distance of 49.9 µm can be ignored in this way).Unit Converter: Small tool to convert numbers between µm and mils.Compare: Opens a new window where two rules can be compared in a table view.
Single check rules:
Outer Signal Rules
Minimum spacing between copper areas of same or different nets on outer layers (used if no copper foil rule can be applied)
Minimum copper trace width on outer layers (used if no copper foil rule can be applied)
Minimum spacing between copper areas and the PCB outline (-1 = deactivated)
Minimum angle in copper areas on outer layers
If active, all SMD pads with soldermask opening and component pin are reported, if they are located completely inside a copper area (no thermal reliefs)
Do not report missing thermal pads, which are located completely under a component body and have a size larger as this value (e.g. cooling pads)
Minimum needed solder mask clearance arround SMD pads (.smd Attribute)
Minimum needed solder mask clearance arround test point pads (.test_point Attribute)
Inner Signal Rules
Minimum spacing between copper areas of same or different nets on inner layers (used if no copper foil rule can be applied)
Minimum copper trace width on inner layers (used if no copper foil rule can be applied)
Minimum spacing between copper areas and the PCB outline (-1 = deactivated)
Minimum angle in copper areas on inner layers
Solder Mask Rules
Minimum distance from the solder mask opening to surrounding copper
Minimum spacing between solder mask clearances (=smallest solder resist fillet)
Minimum width of solder mask clearances
Minimum angle in solder mask clearances
Silkscreen Rules
Minimum distance to any solder mask opening
Minimum distance to any component
Check only text primitives (.nomenclature attribute) for a minimum distance to components, or all primitives
Minimum spacing between silkscreen printings
Minimum size of silkscreen primitives
Minimum spacing between silkscreen printings and the PCB outline (-1 = deactivated)
Minimum angle in silk screen printing
VIA Rules
Minimum needed solder mask clearance for plated through holes (.drill=via)
Minimum needed solder mask clearance for plated through hole copper pads (.drill=via)
If active, mask clearances which are smaller than the VIA-Pad are not reported
If active, missing solder mask openings for VIA drills will not be reported
If active, missing solder mask openings for VIA drills will not be reported
Minimum annular ring for the VIA on outer signal layers
Minimum annular ring for the VIA on inner signal layers
If active, missing copper pads on inner signal layers will not be reported
Minimum distance to surrounding copper on inner layers, if missing pads are accepted
Minimum diameter of plated through holes (.drill=via)
Minimum Distance to any other Drill
PTH / THT Rules
Minimum needed solder mask clearance for through hole technology drills (.drill=plated)
Minimum needed solder mask clearance for through hole technology copper pads (.drill=plated)
Minimum annular ring for the through hole technology drills on outer signal layers (.drill=plated)
Minimum annular ring for the through hole technology drills on inner signal layers (.drill=plated)
If active, missing copper pads on inner signal layers will not be reported
Minimum distance to surrounding copper on inner layers, if missing pads are accepted
If active, all THT copper pads are reported, if they are located completely inside a copper area (no thermal reliefs)
Minimum diameter of through hole technology drills (.drill=plated)
Minimum Distance to any other Drill
NPTH Rules
Minimum needed solder mask clearance for unplated through holes (.drill=non_plated)
Minimum distance to surrounding copper on outer signal layers
Minimum distance to surrounding copper on inner signal layers
Minimum diameter of unplated through holes (.drill=non_plated)
Minimum Distance to any other Drill
MicroVia Rules
Minimum needed solder mask clearance for laser drills
If active, missing solder mask openings for laser drills will not be reported
Minimum annular ring for the laser drill on all affected signal layers
Minimum diameter of laser drills
Minimum Distance to any other Drill
Buried Drill Rules
Minimum annular ring for the drill on outer signal layers
Minimum annular ring for the drill on inner signal layers
If active, missing copper pads on inner signal layers will not be reported
Minimum distance to surrounding copper on inner layers, if missing pads are accepted
Minimum diameter of plated through holes
Minimum distance to any other Drill
Buried Drill Rules
Minimum annular ring for the drill on outer signal layers
Minimum annular ring for the drill on inner signal layers
If active, missing copper pads on inner signal layers will not be reported
Minimum distance to surrounding copper on inner layers, if missing pads are accepted
Minimum diameter of plated through holes
Minimum distance to any other Drill
Copper Foil Rules
Maximum Foil thickness for this rule
Minimum spacing between copper areas of same or different nets on outer layers with this foil
Minimum copper trace width on outer layers with this foil
Minimum spacing between copper areas of same or different nets on inner layers with this foil
Minimum copper trace width on inner layers with this foil