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Rule File Manager

PCBI: Ultimate Physics Fabrication
Tags: Analysis DRC

With the help of the "Rule File Manager" different rule sets can be created and managed.

New:
Create a new rule set with a user defined name.
Save:
Save changes in the currently selected rule set.
Delete:
Delete the currently selected rule set.
Import:
Import a new rule set out of a xml file.
Export:
Export the current rule set to a xml file.
Tolerance:
Tolerance for all check values. All check values will be reduced by e.g. 1% to not show false errors (e.g. when checking for 150µm spacing, a distance of 49.9 µm can be ignored in this way).
Unit Converter:
Small tool to convert numbers between µm and mils.
Compare:
Opens a new window where two rules can be compared in a table view.

 

Single check rules:

 

        • Outer Signal Rules
          DRC Minimum Spacing Minimum spacing between copper areas of same or different nets on outer layers (used if no copper foil rule can be applied)
          DRC Minimum Trace Minimum copper trace width on outer layers (used if no copper foil rule can be applied)
          Minimum spacing between copper areas and the PCB outline (-1 = deactivated)
          DRC Acute Angle Minimum angle in copper areas on outer layers
          DRC Missing Thermal Pad If active, all SMD pads with soldermask opening and component pin are reported, if they are located completely inside a copper area (no thermal reliefs)
          Ignore Thermal Pads Do not report missing thermal pads, which are located completely under a component body and have a size larger as this value (e.g. cooling pads)
          DRC Mask Clearance SMD Minimum needed solder mask clearance arround SMD pads (.smd Attribute)
          DRC Mask Clearance Testpoint Minimum needed solder mask clearance arround test point pads (.test_point Attribute)
        • Inner Signal Rules
          DRC Minimum Spacing Minimum spacing between copper areas of same or different nets on inner layers (used if no copper foil rule can be applied)
          DRC Minimum Trace Minimum copper trace width on inner layers (used if no copper foil rule can be applied)
          Minimum spacing between copper areas and the PCB outline (-1 = deactivated)
          DRC Acute Angle Minimum angle in copper areas on inner layers
        • Solder Mask Rules
          DRC Distance to Copper Minimum distance from the solder mask opening to surrounding copper
          DRC Minimum Space Minimum spacing between solder mask clearances (=smallest solder resist fillet)
          DRC Minimum Trace Minimum width of solder mask clearances
          DRC Minimum Angle Minimum angle in solder mask clearances
        • Silkscreen Rules
          DRC Minimum Mask Distance Minimum distance to any solder mask opening
          DRC Minimum Component Distance Minimum distance to any component
          DRC text primitives Check only text primitives (.nomenclature attribute) for a minimum distance to components, or all primitives
          DRC Minimum Space Minimum spacing between silkscreen printings
          DRC Minimum Size Minimum size of silkscreen primitives
          Minimum spacing between silkscreen printings and the PCB outline (-1 = deactivated)
          DRC Minimum Angle Minimum angle in silk screen printing
        • VIA Rules
          Minimum needed solder mask clearance for plated through holes (.drill=via)
          Minimum needed solder mask clearance for plated through hole copper pads (.drill=via)
          If active, mask clearances which are smaller than the VIA-Pad are not reported
          If active, missing solder mask openings for VIA drills will not be reported
          If active, missing solder mask openings for VIA drills will not be reported
          Minimum annular ring for the VIA on outer signal layers
          Minimum annular ring for the VIA on inner signal layers
          If active, missing copper pads on inner signal layers will not be reported
          Minimum distance to surrounding copper on inner layers, if missing pads are accepted
          Minimum diameter of plated through holes (.drill=via)
          Minimum Distance to any other Drill
        • PTH / THT Rules
          DRC Mask Clearance PTH Minimum needed solder mask clearance for through hole technology drills (.drill=plated)
          DRC Mask Clearance PTH Pads Minimum needed solder mask clearance for through hole technology copper pads (.drill=plated)
          DRC Annular Ring outer Layers Minimum annular ring for the through hole technology drills on outer signal layers (.drill=plated)
          DRC Annular Ring Inner Layers Minimum annular ring for the through hole technology drills on inner signal layers (.drill=plated)
          DRC Missing Pads Inner Layers If active, missing copper pads on inner signal layers will not be reported
          DRC Distance to Copper Minimum distance to surrounding copper on inner layers, if missing pads are accepted
          DRC Missing Thermal Pads THT If active, all THT copper pads are reported, if they are located completely inside a copper area (no thermal reliefs)
          DRC Minimum Diameter Minimum diameter of through hole technology drills (.drill=plated)
          DRC Minimum Drill Distance Minimum Distance to any other Drill
        • NPTH Rules
          DRC Mask Clearance NPTH Minimum needed solder mask clearance for unplated through holes (.drill=non_plated)
          DRC Distance to Copper Outer Layers Minimum distance to surrounding copper on outer signal layers
          DRC Distance to Copper Inner Layers Minimum distance to surrounding copper on inner signal layers
          DRC Minimum Diameter Minimum diameter of unplated through holes (.drill=non_plated)
          DRC Minimum Drill Distance Minimum Distance to any other Drill
        • MicroVia Rules
          DRC Mask Clearance VIA Minimum needed solder mask clearance for laser drills
          DRC Missing Mask If active, missing solder mask openings for laser drills will not be reported
          DRC Annular Ring Minimum annular ring for the laser drill on all affected signal layers
          DRC Minimum Diameter Minimum diameter of laser drills
          DRC Minimum Drill Distance Minimum Distance to any other Drill
        • Buried Drill Rules
          DRC Annular Ring Outer Layers Minimum annular ring for the drill on outer signal layers
          DRC Annular Ring Inner Layers Minimum annular ring for the drill on inner signal layers
          DRC Missing Pads Inner Layers If active, missing copper pads on inner signal layers will not be reported
          DRC Distance to Copper Minimum distance to surrounding copper on inner layers, if missing pads are accepted
          Minimum diameter of plated through holes
          DRC Minimum Drill Distance Minimum distance to any other Drill
        • Buried Drill Rules
          Minimum annular ring for the drill on outer signal layers
          Minimum annular ring for the drill on inner signal layers
          If active, missing copper pads on inner signal layers will not be reported
          Minimum distance to surrounding copper on inner layers, if missing pads are accepted
          Minimum diameter of plated through holes
          Minimum distance to any other Drill
        • Copper Foil Rules
          Foil Thickness Maximum Foil thickness for this rule
          Minimum Space Outers Minimum spacing between copper areas of same or different nets on outer layers with this foil
          Minimum Trace Outer Minimum copper trace width on outer layers with this foil
          Minimum Space Inner Minimum spacing between copper areas of same or different nets on inner layers with this foil
          Minimum Trace Inner Minimum copper trace width on inner layers with this foil