The plugin DFM Analysis can be found under the grid "Analysis" respectively "Assembly". If you click on "DFM Analysis", the following window opens.
In the upper left corner you can see the STEP (1).
Below, you will find three options (2) available for performing the DFM analysis: "Selective Soldering", "Fiducial Solder Mark" (AOI verification), "Panel Dimensions" (technical verification of panels).
To begin with, the first topic is "Selective Soldering". This checks whether the set THT components will fit at the given location or whether the pins or holes of the THT component may be too close to components on the opposite side. The THT components you want to check can be selected either by the property or by the package name. It is also possible to directly select the THT components (3).
Before you can start the "Connector Analysis" (4), you have to define the settings for the analysis. There is a distinction between "Single Pad" (5), "Multi Pad" (6) and "Multi Pad Row" (7). For each case, you can individually define the settings that will be used for the analysis. The pictures are intended to illustrate these variables. Each variable is determined by two different values, the "favorite" or optimum value and the "acceptable" value up to which manufacturability (according to your specifications) is still guaranteed.
The results of the analysis are then displayed in the table on the right-hand side of the window (8). Right-click to export them in HTML format. You can also use the tool to display the result. Components in the yellow area are located in the range you have defined as still acceptable. If a component is within the red area, the producibility with the current design is not guaranteed or the specifications defined by you are not fulfilled.
The following functionalities are equally integrated in all three options ("Selective Soldering", "Fiducial Solder Mark", "Panel Dimensions"):
It is possible to exclude components from the analysis (9). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview. Finally, you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button (10).
Clicking on the question mark (11), the corresponding page of our online manual will open.
The "Fiducial Solder Mark" option allows you to check whether the markers set for the AOI analysis can be implemented according to the selected specifications.
To do this, you must first search for the fiducials in your design (1). Four options, "Pad Usage", "Pad Geometry Name", "Package Name" and direct selection via the tool are provided for this purpose.
You can also check the current fiducials for their manufacturability (2). The different parameters are illustrated in an illustration: CU corresponds to "Copper Diameter", SM to "SolderMask Diameter" and CMP Free to "Component Clearance Diameter". The check is then performed using these settings. Again, the results are displayed in the table on the right (3) or can be viewed directly via the tool.
The "Panel Dimensions" option allows you to check whether your panel meets the specified measurements. In order to be able to start the analysis for the "Panel Dimensions", you must first switch to "panel" in the tool.
The settings for the analysis can be defined under "Panel Size" (1). You can also set the "Minimum Distance" between components and the edge of the panel (2). At the same time, you have to choose an optimal value ("favorite") and a boundary value ("acceptable"). If the acceptable value is not reached, the producibility of the panel is endangered. Furthermore, you can decide, which edge of the board should be checked ("check sides").
The results of the analysis are displayed in the window on the right (3). You can also view the analysis results directly in the tool. Problematic components are marked in blue.