Posts tagged with 'DFM'

Introduction

The plugin DFM Analysis can be found under the grid "Analysis" respectively "Assembly".

Here you will find six tab pages available for performing the DFM analysis: "Selective Soldering", "Fiducial Marker" (AOI verification), "Panelization" (technical verification of panels), "Testpoint", "Solder Paste" and "Trace Under Component". These single analysis functions are described below.

Selective Soldering

To begin with, the first topic is "Selective Soldering". This checks whether the set THT components will fit at the given location or whether the pins or holes of the THT component may be too close to components on the opposite side. The THT components you want to check can be selected either by the property or by the package name. It is also possible to directly select the THT components (1).

Before you can start the "Connector Analysis", you have to define the settings for the analysis. There is a distinction between "Single Pad" (3), "Multi Pad" (4) and "Multi Pad Row" (5). For each case, you can individually define the settings that will be used for the analysis. The pictures are intended to illustrate these variables. Each variable is determined by two different values, the "favorite" or optimum value and the "acceptable" value up to which manufacturability (according to your specifications) is still guaranteed.

The results of the analysis are then displayed in the table on the right-hand side of the window (6). Right-click to export them in HTML format. You can also use the tool to display the result. Components in the yellow area are located in the range you have defined as still acceptable. If a component is within the red area, the producibility with the current design is not guaranteed or the specifications defined by you are not fulfilled. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report')


Following picture shows an example error of this analysis:

The THT component c904 is located on top side, but soldered on bottom side. The yellow marked components are too close to the soldered pins according to the 'Multi Pad' rule. The red area shows the "Acceptable" area, the yellow one is the "Favorite" area.

 

The following functionalities are equally integrated in all six options:

  • It is possible to exclude components from the analysis (2). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview.
  • With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 
  • The last result can be saved and reloaded with the buttons on the lower right side (7). This stored result is also used in the 'Extended Design Report'.
  • Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.

 

Fiducial Solder Mark

The "Fiducial Marker" analysis allows you to check whether the markers set for the AOI analysis can be implemented according to the selected specifications.

To do this, you must first search for the fiducials in your design (1). Four options, "Pad Usage", "Pad Geometry Name", "Package Name" and direct selection via the tool are provided for this purpose.

You can check the found fiducials for their manufacturability with 3 different parameters (3): "Copper Diameter", "SolderMask Diameter" and "Component Clearance Diameter". The check is then performed using these settings. Again, the results are displayed in the table on the right (4) or can be viewed directly via the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

The following functionalities are equally integrated in all six options:

  • It is possible to exclude components from the analysis (2). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview.
  • With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 
  • The last result can be saved and reloaded with the buttons on the lower right side (5). This stored result is also used in the 'Extended Design Report'.
  • Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.

Panelization

The "Panelization" option allows you to check whether your panel meets the specified measurements. In order to be able to start the analysis for the "Panel Dimensions", you must first switch to "panel" in the tool.

 

The size of the panel can be checked in the first block "Panel Size" (1).

You can also set the "Minimum Distance to Panel Edge" between components and the edge of the panel (3). At the same time, you have to choose an optimal value ("favorite") and a boundary value ("acceptable"). If the acceptable value is not reached, the producibility of the panel is endangered. Furthermore, you can decide, which edge of the board should be checked ("check sides").

Last you can analyze the "Board to Board distance" (4). Here the distance between boards, as well as the distance between component and foreign board, and component to component can be checked. Again you can enter an "Acceptable" and "Favorite" distance.

The results of the analysis are displayed in the window on the right (5). You can also view the analysis results directly in the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

Following picture shows an example error of this analysis:

The component c801 of one board is too close to the same component on the neighbored board.

 

The following functionalities are equally integrated in all six options:

  • It is possible to exclude components from the analysis (2). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview.
  • With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 
  • The last result can be saved and reloaded with the buttons on the lower right side (6). This stored result is also used in the 'Extended Design Report'.
  • Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.

Testpoint

The "Testpoint" option allows you to check the distance between testpoints and between testpoint and components. This analysis is important to ensure e.g. the manufacturability of ICT adapters.

In the first block (1) there are different options to identify test points:

  • By Attribute: The ODB++ ".test_point" attribute is used. This attribute might exist at test point copper pads on the outer layers.
  • By Component Referenz: The component reference designator must contain e.g. "TP" (like 'TP120')
  • By Component Package Name: The component package name must contain e.g. "TP" (like 'tp0.8')
  • By Selection: Any selected component or copper pad is used as test point

With the block "Check Values" (3), you can enter the wanted distances between testpoints (center to center) or between testpoint and components (center to outline). 

The results of the analysis are displayed in the window on the right (4). You can also view the analysis results directly in the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

Following picture shows an example error of this analysis:

A component is too close to the test point tp502.

 

The following functionalities are equally integrated in all six options:

  • It is possible to exclude components from the analysis (2). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview.
  • With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 
  • The last result can be saved and reloaded with the buttons on the lower right side (5). This stored result is also used in the 'Extended Design Report'.
  • Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.

Solder Paste

The "Solder Paste" option allows you to check if all component pins have a solder paste object, a copper pad, and a solder mask clearance defined and if the solder paste is inside a solder mask clearance.

In the first block (1) you can define which components should be analysed. Here you have following ignore options:

  • Ignore Components with only one pin (e.g. Test points)
  • Check only Components with the '.comp_mount_type' attribute set to 'SMT'
  • Ignore pins that are connected to the net '$NONE$'

The results of the analysis are displayed in the window on the right (3). You can also view the analysis results directly in the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

Following error types are reported:

  • Missing Paste: No paste object found
  • Missing Mask: No solder mask clearance found
  • Missing CopperPad: No copper pad found
  • Paste on Mask: the paste is intersecting the solder mask clearance

 

The following functionalities are equally integrated in all six options:

  • It is possible to exclude components from the analysis (2). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview.
  • With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 
  • The last result can be saved and reloaded with the buttons on the lower right side (4). This stored result is also used in the 'Extended Design Report'.
  • Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.

Trace Under Component

The "Trace Under Component" option allows you to check, if certain components have unallowed copper tracks under their body between their pins. This is mostly unwanted for small 2-pin components, as it can cause problems during soldering.

In the first block (1) there are different options to identify the components that should be analyzed:

  • Pin Count: Only components with e.g. <=2 pins
  • X Size: The x size should be less than the entered value
  • Y Size: The y size should be less than the entered value.
  • Property: A given property must contain a certain value string

With the block "Keepout Area Definition" (3), you can enter the wanted undersize that is used to determine the keepout area under the component body and between its pins. 

The results of the analysis are displayed in the window on the right (4). You can also view the analysis results directly in the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

Following picture shows an example error of this analysis:

The component "r808" has unwanted copper tracks under its body inside the keepout area.

 

The following functionalities are equally integrated in all six options:

  • It is possible to exclude components from the analysis (2). You can do this either via "Pin Count", "Height" or "Property". Furthermore, a search function via "List" is available, which lists all excluded parts in an overview.
  • With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 
  • The last result can be saved and reloaded with the buttons on the lower right side (5). This stored result is also used in the 'Extended Design Report'.
  • Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.

Introduction

The plugin Component Analysis can be found under the grid "Analysis" respectively "Assembly".

Here you will find two tab pages available for performing the Component Analysis: "Component Distance Analysis" and "Component Placement Analysis". These single analysis functions are described below.

Component Distance Analysis

The "Component Distance Analysis" option allows you to check the distance between components and between components and the board outline. This analysis is important to ensure e.g. the manufacturability during the placement and soldering process.

In the first block (1) you can define the different check values:

  • "Outline to Outline": Min. needed distance between component bodies
  • "Pad to Outline": Min. needed distance between the copper pads of one component to the body of the neighbour components
  • "Pad to Pad": Min. needed distance between the copper pads of one component to the copper pads of the neighbour components
  • "Outline to Board Outline": Min. needed distance between component bodies and the board outline

Here you also have the possibility, to ignore unplaced components (by ignoring components with a ".comp_ignore' attribute).

In the second block (2), you can define "Special Distances acc. Property". That means, you can define the same set of rules as in (1) but with different values for sub groups of components. The sub groups are build by a given component property. Examples are:

  • if your design has a property with package groups per component, you can set different check values for e.g. SOTs or ICs
  • if your design has a property with detailed component descriptions, you can set different check values for e.g. ceramic capacitors or mosfets

The results of the analysis are displayed in the window on the bottom (3). You can also view the analysis results directly in the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 

The last result can be saved and reloaded with the buttons on the lower left side (4). This stored result is also used in the 'Extended Design Report'.

Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.


Following picture shows an example error of this analysis:

The copper pad of the X1-1 is too close the the component body of C36.

 

Component Placement Analysis

The "Component Placement Analysis" option allows you to check, if the MPN Package of a component fits the CAD Package.
A MPN Package (MPN = Material Part Number) is the real component outline of a part. This outline is often much smaller than the corresponding CAD package body. The MPN Package can also contain the contact surface of the pin. In this analysis, this contact surface of the pins is analyzed. You can define, where the contact surface has to be situated inside the copper pad.

A standard design has no MPN Package definitions included. EasyLogix offers the 'EasyLogix Part Library' (EPL) to add detailed part information like datasheets, MPN packages, 3D step files, ... to your design.

In the first block (1), you can define the different check values:

  • "Outer Distance": The minimum distance of the pins contact surface to the outer edge of the copper pad in % of the pad's width
  • "Inner Distance": The minimum distance of the pins contact surface to the inner edge of the copper pad in % of the pad's width
  • "Side Distance": The minimum distance of the pins contact surface to the side edges of the copper pad in % of the pad's height
  • "Center Distance": The minimum distance of the pins contact surface to all edges of the copper pad in % of the pad's min. size - only for pins that are located under its component body

In the second block (2), you can define filters to ignore unplaced components (by ignoring components with a ".comp_ignore' attribute) and components without MPN package definitions.

In the third block (3), you can define "Special Distances acc. Property". That means, you can define the same set of rules as in (1) but with different values for sub groups of components. The sub groups are build by a given component property. Examples are:

  • if your design has a property with package groups per component, you can set different check values for e.g. SOTs or ICs
  • if your design has a property with detailed component descriptions, you can set different check values for e.g. ceramic capacitors or mosfets

The results of the analysis are displayed in the window on the bottom (4). You can also view the analysis results directly in the tool. Critical errors can also be marked for later use (e.g. in the 'Extended Design Report').

With the buttons on the top right side of the window you can export the previously defined settings so that you can reuse them for later analyses. Already saved settings can be imported via the "Import Settings" button. 

The last result can be saved and reloaded with the buttons on the lower left side (5). This stored result is also used in the 'Extended Design Report'.

Clicking on the question mark on the top right of the window opens the corresponding page of our online manual.


Following picture shows an example error of this analysis:

The contact surface of the pin 2 of the MPN Package for D30 is not matching the "inner distance" rule. That means in this case, the pin's contact surface is partly outside the copper pad. A reason could be, that the choosen part (MPN) does not fit to the CAD data. Soldering issues and failures are likely.

 

Assign Testpoint Attribute

User Interface of the Assign Testpoint Attribute
Fig 5. - User Interface Assign Testpoint Attribute


You can find the Testpoint Assign Tool under Plugin >> Assign Testpoint Attribute.
This tool helps to find and mark testpoints in a layout which could be defined via multiple non standardized attributes. Marking them with this tool then helps to standardize this and prepare the layout for following tools (for example the DFT Preperation).
On the top left you can switch between using the current selection or a set rule to find the testpoints and assign the test_point value.
When choosing rules you can add another rule by checking the checkbox of the lowest row in the current listview and then fill out which attribute should be tested and what value needs to be set in said attribute.
All attributes are listed in a simple drop down menu. The Filter Value then has to represent the value of the attribute. Wildcards are allowed when searching for attribute values. The image shows for example all ways to search for "tp" in the "geometry" attribute:

  • The first rows searches for all geometry attributes that have exacly the value "tp".
  • The second row seraches for all geometry attributes that end with "tp"
  • The third row searches for all geometry attributes that start with "tp"
  • The fourth row searches for all geometry attributes that have "tp" anywhere in their value

Also it is possible to search for multiple values of the same attribute as shown in the last row. Simply seperate the values with a semicolon.
Boolean attributes do not need any value since their existance already means they are set.
To remove a rule simply select the whole row by clicking on the left most column of the row you want to delete (left of Use Rule) and press the "delete" key on your keyboard.

Checking a rule will select all found possible testpoints of the job (the checkboxes Assign Top and Assign Bottom change the selection depending on the check state of them)

On the top right side there is an information panel showing:

  •  The currently already set testpoints of the loaded job for the top layer and the bottom layer
  •  A button to open this help page
  •  A button to select all currently set testpoints of the loaded job

Export Rules exports the currently set rules to a xml file on selected location on the machine or in a cloud
Import Rules imports rules from a file either from the machine or from a cloud
Remove all Testpoint Attributes removes the "test_point" attribute from all pads of the job
Assign Testpoint Attribute adds the "test_point" attribute to either the currently selected pads or the pads found by the selected rule (handled by the radiobuttons "using Selction" and "using Rule")
Assign Top is a checkbox that when unchecked the "test_point" attribute will not be set for the pads on the top layer
Assign Bottom is a checkbox that when unchecked the "test_point" attribute will not be set for the pads on the bottom layer

To find possible testpoints the attribute histogram is a good way to start.